SWIR cameras with InGaAs sensor
The cameras from New Imaging Technologies are suitable for a wide range of applications in which information can be acquired via imaging analyses. The cameras are based on SWIR (short wave infrared) technology, with a wavelength range of 0.9 to 1.7 µm and InGaAs sensors. New Imaging Technologies’ patented structure and properties of the InGaAs sensors allow these sensors to be connected to the readout circuit with sub-micrometer accuracy and it enables the SWIR cameras to have a fast pixel response time with even low bias current and the InGaAs photodiode array has a high dynamic range in the optical signal.
Contact person
The special feature of the SWIR technology used is the detection of reflections, i.e. the light is reflected/absorbed by an object, unlike in (near or mid) infrared technology, where the object itself emits thermal radiation. Above all, the only natural light sources are the sun during the day and the stars at night. Interfering light sources are therefore limited. Furthermore, fog, smoke and comparable effects are considered as low risk factors for disruption in imaging.
The cameras operate in the so-called “retina-safe range”, in which the human eye absorbs light greater than 1.55 µm, preventing damage to the retina. As a result, the cameras can be used not only in industry and research, but also for in-field measurements.
SWIR cameras in comparison
| WiDy SWIR | WiDy SenS | HiPe SenS | SenS | LiSaSWIR | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| 640 | NaNo | 320 | 640 | 640 | 1280 | 1920 | 2048 | |||
| Resolution | VGA 640 x 512 | VGA 640 x 512 | QVGA 320 x 256 | VGA 640 x 512 | VGA 640 x 512 | SXGA 1280 x 1024 | FHD 1920 x 1080 | line scan 2048×1 | ||
| Spectral range | 0.9 – 1.7 µm | 0.9 – 1.7 µm | 0.9 – 1.7 µm | 0.9 – 1.7 µm | 0.9 – 1.7 µm | 0.9 – 1.7 µm | 0.9 – 1.7 µm | 0.9 – 1.7 µm | ||
| Intelligent | No | No | partly | partly | no | partly | no | yes | ||
| Pixel pitch | 15 µm | 15 µm | 15 µm | 15 µm | 15 µm | 10 µm | 8 µm | 8×14 µm or 8×200 µm | ||
| Connection | USB3.0 CameraLink GigE Analog | USB3.0 | USB3.0 CameraLink GigE | USB3.0 CameraLink GigE Analog HD-SDI | USB3.0 CameraLink | USB3.0 CameraLink | USB3.0 CameraLink | CameraLink base | ||
| Gain / Mode | Snapshot | Snapshot | CTIA High Gain, CTIA Low Gain, LOG Mode | CTIA High Gain, CTIA Low Gain, LOG Mode | Linear (3 Gain Levels) | CTIA High Gain, CTIA Low Gain | CTIA (Low & High Gain) | Low Gain, Medium Gain, High Gain | ||
| Sesnor noise e- | 50 e-, 270 e-, 340 e- | 50 e-, 125 e-, 270 e- / 290 e- / 340 e- | <40 e- | typ. 30 e-, typ. 120 e- | typ. 25 e- | <90 e-, <370 e-, <2200 e- | ||||
| Dynamic range | 120 dB | 120 dB | 49 dB, 63 dB, 120 dB | 49 dB, 44 dB, 63 dB / 58 dB / 120 dB | – | 52 dB, 61 dB | 64 dB | 55–66 dB, 55–66 dB, 55–66 dB | ||
| Frame rate | 100 Hz | 100 Hz | Up to 1 kHz (full), 10 kHz (ROI) | Up to 230 fps | Up to 230 fps | 60 Hz | >60 Hz full frame | >110 kHz | ||
| Exposure or integration time | 100 µs – 200 ms | 100 µs – 25 ms | Exposure 10 µs (standard),1 µs option; TEC | 10 µs – 1 s; Gated 100 ns–9 µs | 10 µs – 112 s | 10 µs – 500 ms | ROI, ITR, CDS | Min integration 1 µs | ||
| Trigger | IN/OUT | No | TEC on/off | TEC on/off | IN/OUT | IN/OUT and delays | Internal/external | |||
| Well capacity | – | – | >17 Ke- >380 Ke- ≈500 Me- | >17 Ke- >17 Ke- >380 Ke- / >230 Ke- / ≈500 Me- | – | >10 Ke- >130 Ke- | – | – | ||
| Dimensions / Weight | 48.6×48.6×42.2 mm; <160 g | 25×25×29 mm; <125 g | 46×46×53 mm; <215 g | 46×46×57/65.4 mm; <215 g | 46×57×112 mm; <215 g | 58×58×70 mm; <400 g | 58×58×70 mm; <400 g | 45.4×75×58 mm; 280 g | ||
| Software / special features | Supports multiple GUIs (NITVision, WiDyCAM, NITLink) | NITVision GUI | NITVision GUI; High-speed mode metrics | NITVision GUI; High-speed mode metrics | TEC2 + fan air-cooled; WiDyVISION/WiDyCAM GUIs | Compact: NITVision; Smart: GenICam features (AGC, AIT, NUC, BPR) | NITVision GUI; SDK (C++, C#, Python) | GenICam compliant (NITGenicamControlTool) | ||
Application examples for SWIR cameras with InGaAs sensor
Semiconductor inspection
In the semiconductor industry, SWIR cameras can be used to detect cracks and defects on wafers or solar cell panels and to check and monitor integrated circuits in silicon wafers, as silicon is inactive in this wavelength range. The LiSa SWIR V2, a line scan camera, was specially developed for the inspection of semiconductors, as this camera delivers clear images with a high throughput – thanks to the small pixel size of 8 µm and the line scan. The two cameras in the SenS series are suitable for high-resolution images. Cameras from the LiSa SWIR V2, SenS, HiPe SenS and WiDy SWIR series can be used.
Laser application
In laser applications, such as laser superstructures, laser communication, laser beam profiles or LIDAR (Light Detection and Ranging), the laser beam can be monitored via an automatic and intelligent camera. As a result, costs and effort in monitoring can be saved and camera oversaturation can be prevented. Cameras from the WiDy SenS and WiDy SWIR series can be used.
Security & surveillance
The SWIR cameras can be used in a wide range of environmental conditions, as fog/smoke/snow/similar conditions hardly interfere with imaging. The cameras can be used for everything from monitoring and detecting moving objects, such as threats or cars, to estimating distances and obstacles, even in poor environmental conditions. Cameras from the SenS, WiDy SenS and HiPe SenS series can be used.
Welding, additive manufacturing and industrial monitoring
Monitoring the welding process in additive manufacturing is very challenging, as in addition to the presence of smoke and dust, the lighting conditions are strong and contrasting. The WiDy SenS 320 can be used for industrial surveillance as it is a high-speed camera. If the pure welding process is being observed, the Magic Camera, which can take high-quality images in the melting pool without disturbing light circles and saturation or with which the welding arc and the welding bevel can be observed simultaneously, is suitable. Cameras from the WiDy SenS and WiDy SWIR and Magic Cameras series can be used.
Medicine & Life Science; Research & Development
SWIR technology enables depth imaging of in vivo applications without the use of X-ray technology. Furthermore, FDA-approved dyes can be used, which have a strong absorption in the range of 1300 to 1400 nm. Cameras from the SenS, WiDy SenS and HiPe SenS series can be used.
Process sorting; solar panel inspection; hot glass inspection
As soon as individual objects need to be monitored quickly and only one line needs to be scanned, the LiSa V2 line scan array is the best choice as it has a high image resolution. The LiSa SWIR V2 is best used for these applications.